Integratedtestandwirebonding
frameforopticalglass
1.Integrateddesignofwirerepairandlightingtest;
2.Dual-displayhigh-definitionimaging,zoomingintoshowthefinedetails
ofpixelelectrodesLine,three-axisfineadjustmentplatformforprecise
positioning;
3.Thecounterparthostadoptsastandardizeduniversalstructure,allowing
foreasyreplacementofthecarrierboardDifferenttypesofopticalglasscan
beswitchedtoreduceequipmentcostsandstreamlineproductionFast
changeoverspeed;
4.Theentiremachineismadeofanti-staticbakelitematerialtoprevent
electrostaticbreakdown;
5.Lightweightandcompactdesign,withasmallsize.
Size:373*233*265.5mm
Equipmentpurpose
Repairofpixelbrightspotsandlineshort-circuitdefectsinthefront-end
manufacturingprocessofOLEDlight-emittingglass;PanelR&Dlaboratory
sampletesting;batchlightprocessingforsmallandmedium-sizedscreen
processingfactoriesGlassrepairandlightingscreening.